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MANUAL PLATING PROCESS EQUIPMENT
Fully automatic or manual DICP lines are design to plate high aspect ratio 20 to 1. Design to plate more copper in the hole then the surface 1.5 to 1 on surface. Design to plate 2 mil blind vias .020 deep. Design to plate 2 mil line with 3 mil space. Standard tank size for auto line 66” wide x 58” deep x 48” long with two cathodes can plate 8 panels in 30 minutes at 25 asf. Standard tank for manual line is 66” wide x 48” deep x 58” long with 2 cathodes can plate 8 panels in 30 minutes at 25 asf.

Metalizing Lines
Metalizing lines with eductors and ultrasonic capable producing 20 to 1 aspect ratio.

Oxide Lines w/ Eductors
Expertly designed for even deposition and better adhesive to consequently reduce rejects.

Direct Impingement Plating Tank w/ Eductors
20 to 1 aspect ratio, 2 mil lines with 3mil spacing.

Permanganate Lines w/ Eductors
Custom built to achieve uniform desmear and eliminate negative etchback.

Nickel & Gold Lines w/ Eductors
Meticulously crafted to eliminate measling and produce even plating.

 

 
     
     
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